11 Μάι DTIS 2019

13th IEEE International Conference on Design & Technology of Integrated Systems in Nanoscale Era

DTIS 2018

April 10-12, 2018, Taormina, Italy

Aim of the Conference: to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. Topics of the conference include, but are not limited to:

Integrated Systems Design:

• SOC, SIP design
• Multiprocessor systems
• Embedded systems
• Wireless systems
• Network on Chip
• Analog, Mixed Signal and RF systems
• MEMS and MOEMS systems
• Low Voltage and Low Power systems
• Innovative technologies
• Synthesis (physical, logic)
• Simulation, Validation and Verification
• 3D integration
• Hardware Security

Integrated Systems Technology:

• Nanoelectronics
• Device modeling
• Material characterization
• Failure analysis
• New components
• Packaging
• Process technology
• Reliability issues
• 3D integration

Integrated Systems Testing:

• Defect and fault modeling
• Analog and Mixed Signal testing
• MEMS/MOEMS testing
• SOC and SIP testing
• Delay testing
• Memory testing
• Fault Simulation, ATPG
• DFT, BIST and BISR
• On-line testing and fault tolerant systems
• ATE issues
• Alternative test strategies
• 3D testing
• Test and Security Issues
• FPGA design